TSMC: the first 3D IC advanced packaging plant will be mass produced in the second half of the year

       TSMC today (17) announced two major breakthroughs made by 3dfabric platform at the 2022 North American technology forum, and said that TSMC's first fully automated 3dic advanced packaging plant in the world would be mass produced in the second half of the year.

  According to the United Daily, Taiwan, China media, first, TSMC has completed the world's first central processing unit based on integrated chip stack (TSMC soictm) of various application systems. Chip on wafer (cow) technology is used to stack three-level cache static random access memory.

  Second, the innovative intelligent processor uses wafer on wafer (wafer on wafer, wow) technology to stack on deep trench capacitor chip.

  In addition, TSMC said that in order to meet customers' demand for system integration chips and other TSMC 3dfabric system integration services, it will build the world's first fully automated 3dfabric advanced packaging plant in Zhunan and is expected to start production in the second half of this year.

Source: United Daily