Bumping is to make bumps or micro bumps on the wafer to realize the electrical connection between the chip and PCB or substrate. It is widely used in WLCSP, FC and fo processes.
Learn moreWafer fan in and fan out packaging are the main products of wafer level packaging at present. In particular, fan out packaging has developed rapidly in recent years. Combined with chip reconfiguration of homogeneous and heterogeneous chips, system level packaging of chips has been realized
Learn more2.5D is the planar integration of multiple chips using wafer TSV technology, while the current 3D technology is based on 2.5D and realizes vertical stacking of chips through TSV (or bonding), so as to achieve the maximum optimization in bandwidth, high speed, power consumption and cost.
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