In the vacuum environment, the product is welded with high quality by reducing the oxygen content. During the welding process, reducing gas (formic acid, N2 / H2, H2) is introduced to protect the product and solder from oxidation, and at the same time, the oxide on the surface of the product and solder is removed to improve the quality of the welding surface and reduce the void rate of the welding. It is especially suitable for the welding of large chips and high demand vehicle power chips
Vacuum formic acid reflow equipment has a wide range of applications. At present, it mainly focuses on the packaging of power device modules. In the future, it can be expanded to the application of advanced chip packaging.
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