It is applied to the curing of organic materials such as wafer grade polyimide, BCB and PbO, and wafer annealing to realize full automatic operation and high output, provide rapid temperature rise and fall, high cleanliness and low oxygen concentration, and ensure product quality and productivity.
应用于晶圆级 Polyimide, BCB及PBO等有机材料的固化，wafer annealing, 实现全自动化操作及高产出，提供快速的升降温、高洁净度、低氧浓度，保证产品的质量及产能。在以下工艺过程中，根据工艺条件和产能的要求，都会用到PIQ设备
- Bumping
- WLCSP
- Fan-out
- 2.5D/3D
- MEMS
1. Position and function of polyimide in bumping process.
2. In the fan out process, multilayer polyimide is applied in metal interconnection, and the smaller the line width, the higher the requirements for PI curing.
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