With the increase of packaging density, bubbles in underfill (UF) and die attach film (DAF) have more and more serious effects on the performance and reliability of packaging products. Controllable high pressure and high temperature process can effectively remove bubbles in UF and DAF. Adjust the temperature to change the fluidity of the material, and at the same time, remove large volume of bubbles with vacuum. Then, according to the characteristics of the material, apply high pressure and increase the curing temperature to dissolve the fine bubbles in the colloid and solidify them to achieve the purpose of removing bubbles
Technical index of pressure oven:
According to the needs of customers, reaction chambers with different pressures and temperatures can be customized. The maximum pressure can reach 15kgf and the temperature can reach 250 ℃.
Pressure oven has many uses in curing and bubble removal, mainly in the following four aspects:
1. Bubble removal and solidification of underfill
2.Flash memory stack
3. LED Encap
4. Film Lamination
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